Abstract:
Ground bounce is a common problem in packages, connectors and circuit boards. And it gets worse with shorter rise times. This insidious problem can cause enough cross talk to break almost any product.
 
In this webinar, we will look at the principles behind the root cause of ground bounce, how we can measure the ground bounce in your system, and based on the root cause, how we can design ground bounce out of your next product.  


Presenter:  








Dr. Eric Bogatin
Signal Integrity Evangelist Teledyne LeCroy

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ON DEMAND WEBINAR:
Don’t Let Ground Bounce Ruin your Day
 

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Additional Resources:

Website:  Signal Integrity Academy

Book: Signal and Power Integrity - Simplified, 2nd Edition By Eric Bogatin  

Upcoming Webinar: Secrets of Oscilloscope Probing Of Signals and Power Rails, Revealed!