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LIVE WEBINAR
USB Type-C Technologies Testing 
Part 1


 

When: Wed, April 3, 2019
Time: 11:00AM Pacific | 2:00PM Eastern


The USB Type-C™ Connector is gaining momentum in the PC Industry. The latest technologies under development over the USB Type-C connector offers Power Delivery, USB 3.2 (10Gb/s), DisplayPort 1.4 (8.1Gb/s), and Thunderbolt 3 (20Gb/s), as well as other proprietary 'Alt Modes' and faster date rates in the future. A simple, reversible connector carrying multiple protocols, provides end users with a tremendous user experience. However what's simple for the end user; creates new and complex test challenges for developers.
 
This two part webinar will provide attendees with a high level overview of Physical Layer testing of USB 3.2, DisplayPort 1.4, and Thunderbolt 3 over the USB-C connector using Teledyne LeCroy Oscilloscopes, Protocol Analyzers, and partner solutions.
 
Part 1:

  • USB-C Technologies Overview: USB 3.2, DisplayPort 1.4, Thunderbolt 3
  • The USB-C Connector Pinout and Signaling
  • Signal Access Fixtures and Sideband DUT Control
  • USB 3.2 Compliance Requirements and Testing: Physical Layer and Power Delivery
  • Electrical and Protocol Debug techniques for USB 3.2 over Type-C Designs
To learn about Part 2, please click here

If you are a developer or manager that will have a role in designing, specifying, testing, and qualifying USB Type-C based products or building blocks this webinar is for you. 


Presenter: Mike Engbretson, Field Applications Engineer, Teledyne LeCroy


Can't attend live? Register to receive the recording after the live event

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