When: Wednesday, Sept 11th
Time: 10:00AM - 3:30PM (Includes lunch)
Where: Teledyne LeCroy
765 Sycamore Drive, Milpitas, CA 95035
Cost: FREE to attend but seating is limited. Register soon to guarantee your seat.
In this full day live lecture/demo event, you will learn the fundamentals of time domain and frequency domain analysis of interconnects using TDR responses and S-parameters. If you deal with any aspect of TDR or S-parameters, this live event is for you.
All attendees* will receive a 3 month complimentary subscription to the Teledyne LeCroy Signal Integrity Academy courtesy of Stefan Wierzoch, Teledyne LeCroy, and Ward Davis Associates.
10:00AM – Registration
10:30AM – 12:00PM - What does the TDR actually measure
TDR measurements are based on four important essential principles, all related to how signal propagate on interconnects. We explore these principles through simple examples and measurements of cables and circuit board traces. You will never look at TDR traces the same after learning this perspective.
12:00PM – 12:30PM - Lunch
- Courtesy of Teledyne LeCroy
12:30PM – 2:00PM - Beyond the TDR
The 1-port TDR is an incredibly useful device to characterize interconnects. But it is limited. We will introduce the WavePulser 40iX which can display the TDR response with 4-ports. This will allow us to measure the TDT response, differential and common signal TDR, cross talk and mode conversion. With single-ended and mixed-mode responses, there are more than a dozen different measurements possible. In this “master class”, you will learn what each term tells us about an interconnect and how to get the most out of these measurements.
2:00PM – 3:30PM - How to Read S-parameters Like a Book
The most common method to characterize the electrical properties of interconnects is using S-parameters in the frequency domain. They are also very confusing to most SI engineers. In this session, we will open the lid to the black box of S-parameters and look at how to interpret their patterns to reveal the important features of the interconnect. We will reveal how the return loss gets its ripples, the connection between return and insertion loss, why the return loss drops off and what accounts for some of the large dips we sometimes see in insertion loss. Never be intimidated by S-parameters after attending this seminar.
*This offer applies to attendees only
Signal Integrity Academy Live with Eric Bogatin - High Speed Interconnect Characterization
Eric Bogatin is currently the Dean of the Teledyne LeCroy Signal Integrity Academy. Additionally, he is an Adjunct Professor at the University of Colorado – Boulder in the ECEE dept, where he teaches a graduate class in signal integrity and is the editor of the new journal, Signal Integrity Journal.
PLEASE NOTE: All visitors must provide valid government Photo identification prior to gaining access to a Teledyne facility. This can be in the form of a driver's license or passport.