When: Weds, September 18, 2019
Time: 10:00AM - 1:00 PM (Includes lunch)
Where: Teledyne LeCroy
27007 Hills Tech Court
Farmington Hills, MI 48331
High speed serial communication technologies have been growing increasingly popular due to faster data communications, smaller form factors and lower power requirements. However, this has also created several signal integrity challenges, especially with respect to interconnects.
In this seminar we will discuss analysis of high speed interconnects such as backplanes, connectors, PCBs and cables. We will start by looking at interconnects in the time domain by observing the impedance profile, step response and impulse response to gain valuable insights regarding the instantaneous impedance, impedance discontinuities and their location.
We will then extend the analysis to the frequency domain by observing the s-parameters and applying our understanding of the impedance profiles to gain a deeper understanding of the interconnect.
We will introduce the value of looking at multi-port and mixed mode TDR and impedance measurements and discuss best measurement practices. This seminar will have a live demo section featuring the new WavePulser 40iX from Teledyne LeCroy to apply the previously discussed techniques to several measurement and debug examples.
Cost: FREE, registration is required to hold your seat.
Register for the Seminar
Seminar: High Speed Interconnect Analysis
in The Time and Frequency Domains
PLEASE NOTE: All visitors must provide valid government photo identification prior to gaining access to a Teledyne facility. This can be in the form of a driver's license or passport.