When: Tues, December 17, 2019

Time: 10:00AM - 1:00 PM (Includes lunch)

Where: Teledyne LeCroy
765 Sycamore Drive
Milpitas, CA 95035

Serial communication technologies have been growing increasingly popular due to faster data communications, smaller form factors and lower power requirements. However, this has also created several signal integrity challenges, especially with respect to interconnects.

In this seminar, we open the black box of S-parameters to reveal the essential principles to build an intuitive understanding of what they are and how their patterns reveal physical features in the interconnects. In particular, we explore the connection between return and insertion loss and how the physical design of interconnects affects these two S-parameters.

We will then extend the analysis to the frequency domain by observing the s-parameters and applying our understanding of the impedance profiles to gain a deeper understanding of the interconnect.

Cost: FREE, registration is required to hold your seat.


Register for the Seminar

Seminar: Reading S Parameters Like a Book


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