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Fundamentals of Characterizing High-speed Serial Data Interconnects Webinar


Using S-parameters and Impedance Profiles

NOW AVAILABLE ON DEMAND

This webinar was originally held on April 6, 2022.

Fundamentals of Characterizing High-speed Interconnects Webinar

Join Teledyne LeCroy to learn more about the impact of high-speed serial data interconnects on your circuit design. We will discuss S-parameters and impedance profiles and how to interpret them, and then use S-parameter files to make eye diagram and jitter measurements on a differential signal passing through a sample channel.

Topics to be included:

  • Overview of single-ended and mixed-mode S-parameters
  • How to understand an impedance profile
  • Using an S-parameter file to emulate channel degradation
  • Reciprocity, passivity, and causality

Who should attend?
Hardware Engineers who use a Vector Network Analyzer (VNA) and/or a Time Domain Reflectometer (TDR) and who are measuring high-speed serial data signals transmitted over cables, connectors, backplanes, or on-board transmission lines and vias.

What attendees will learn?
To get the best time- and frequency-domain insight into their high-speed design.

Presenter: Giuseppe Leccia, Teledyne LeCroy Business Development Manager



You may also be interested in the following webinars:
How to Read S-Parameters Like a Book Part 1 
How to Read S-Parameters Like a Book Part 2

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