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Teledyne LeCroy Seminar

Live Webinar:
How to De-embed Interconnect Elements in Both Frequency and Time Domains


Date: Wed., March 10, 2021
Time: 3PM CET


Join Teledyne LeCroy as we describe and demonstrate best practices for de-embedding test fixtures, cables, and probes from serial data link and other signal integrity measurements. This is a critically important process to ensure that the signal integrity measurements for the DUT are not contaminated by the interconnection elements.

TDR Advanced  Webinar

Topics to be covered in this webinar:

• Why de-embedding is almost always necessary
• Define a reference plane with manual calibration
• Traditional frequency-domain de-embedding
• Time-domain gating and peeling (i.e. fixture removal, ISD…)
• Causality condition

Who should attend? Hardware engineers using a Vector Network Analyzer (VNA) and using emulation systems to characterize their high-speed serial data transmission systems.

What will attendees learn? How to achieve the S-parameter measure of high-speed interconnects that represent its true behavior.

Presented by: Giuseppe Leccia, Teledyne LeCroy, Business Development Manager, High-Speed Interconnect Analysis

Can't attend live? Register anyway and we will send you the recording and slides afterward.

By ticking this box you agree to receive information from Teledyne and our authorized sales representatives and distributors about our latest news, events and products and/or services by email. Please see our privacy policy at http://www.teledyne.com/privacy-policy

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