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Live Webinar:
How to read S-parameters and Impedance Profile for characterizing High-speed Serial Data Interconnects


Date: Wed. 26 January 2022
Time: 11:00 CET

Join Teledyne LeCroy to learn more about the impact of high-speed serial data interconnects on your circuit design. We will discuss S-parameters and impedance profiles and how to interpret them. We will then use S-parameter files to make eye diagram and jitter measurements on a differential signal passing through a sample channel.

>S-Parameters Webinar

Topics to be included:

  • Overview of single-ended and mixed-mode S-parameters
  • How to understand an impedance profile
  • Using an S-parameter file to emulate channel degradation
  • Reciprocity, passivity, and causality

Who should attend? Hardware Engineers who use a Vector Network Analyzer (VNA) and/or a Time Domain Reflectometer (TDR) and who are measuring high-speed serial data signals transmitted over cables, connectors, backplanes, or on-board transmission lines and vias.

What attendees will learn? How to get the best time- and frequency-domain insight into their high-speed design

Presenter: Giuseppe Leccia, Business Development Manager, T3 High Value & High-speed Interconnect Analysis , Teledyne LeCroy

Can't attend live? Register anyway and we will send you the recording and slides afterward.

By ticking this box you agree to receive information from Teledyne and our authorized sales representatives and distributors about our latest news, events and products and/or services by email. Please see our privacy policy at http://www.teledyne.com/privacy-policy

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