AVAILABLE ON-DEMAND
This webinar was originally held on December 7, 2022.
Become an Expert in Measurement-Simulation Correlation for High-speed Serial Data Links
Join Teledyne LeCroy, Professor Eric Bogatin and Ansys to learn best practices and measurement and simulation processes critical in designing high-speed serial data links. The process and best practices will be described, and a well-characterized test device will be used with a measurement-simulation correlation to validate the process.
A PRBS signal will be transmitted through the interconnect test device, and the signal quality will be measured using an eye diagram on an oscilloscope and compared to the simulated response.
Topics to be covered in this webinar:
- The candidate test device to model and measure
- How to perform accurate S-parameter measurements
- Simulating the S-parameters for an interconnect structure
- Measuring the eye diagram with an oscilloscope
- The measurement simulation correlation process
Who should attend? Engineers involved in interconnect design, PCB design, high speed serial link design, test, or hardware engineering with data rates above 1 Gbps.
What attendees will learn? How to perform measurement-simulation correlation using Ansys HFSS, make S-parameter measurements, and make eye diagram measurements using a PRBS source and oscilloscope.
Presented by: Eric Bogatin, Teledyne LeCroy Fellow and Professor, ECEE Univ of Colorado, Boulder