For Solid-state Device (SSD) Manufacturers, uncovering, isolating, and resolving hard-to-find bugs before their products enter the manufacturing phase can be particularly difficult and cumbersome.
Teledyne LeCroy's Summit PCIe Analyzers and OakGate SSD Test Platforms provide comprehensive toolsets to help during the design verification and reliability test phases. Each tool operates separately at different OSI transaction layers.
Teledyne LeCroy has added triggering capability allowing the OakGate SSD Platform to physically connect to a Summit PCIe Analyzer and record the detailed transactions from both at the same time.
This trigger can help the test engineer minimize endless problem replication cycles while trying to capture the error trace. The new triggering capabilities allow customers to easily capture errors that challenged the previous limited trigger methods and enable new use cases to be solved more easily. These include link setting mismatches, command timeouts, unanticipated latencies, and intermittent or undefined errors.
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The new “Better Together” features will be available with OakGate's SSD Test Software, SVF/Enduro v5.3, in July.
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