Date: Wednesday, February 11, 2026
Time: 2 PM Eastern | 11 AM Pacific
Duration: 60 minutes
Introduction to Characterizing Serial Data Interconnects
to the IEEE 370-2020 Standard
Join Teledyne LeCroy as we describe how to accurately characterize and de embed high speed serial data interconnects and test fixtures. We will walk through the application of 2x Thru algorithms, as defined in the IEEE 370 2020 Standard for Electrical Characterization of Printed Circuit Board and Related Interconnects up to 50 GHz, and demonstrate how these methods improve the quality of S-parameter measurements.
Topics to be covered in this webinar:
- Overview of test fixture measurement challenge
- 1x-Reflect-Short and 1x-Reflect-Open algorithms
- 2x-Thru algorithm
- Methods to isolate test fixture S-parameter profile from cables and other interconnections
- Summary of solutions available
Who should attend? Design engineers involved in test and validation of ASICs and designs that utilize high-speed serial data links and/or require validation or compliance test with test fixtures.
What will attendees learn? Why IEEE 370-2020 2x-Thru algorithms are necessary and how to correctly apply them to real-world measurements.
Presented by: Giuseppe Leccia, Teledyne LeCroy Product Marketing Manager
Can't attend live? Register anyway and we will send you the recording afterward.