Date: Wednesday, 11 February 2026
Time: 10:00 AM CET
Maximizing S‑Parameter Accuracy with Advanced Impedance‑Corrected 2xThru De‑Embedding
Discover how Teledyne LeCroy can help you dramatically improve S parameter accuracy for your interconnects using a straightforward and highly effective 2xThru de embedding approach. You will also learn how WavePulser Network Analyzer TDR technology enables precise, impedance corrected measurements fully aligned with the IEEE 370 2020 Standard for the electrical characterization of PCBs and related interconnects.
In addition, we will cover the 1xReflect (Open/Short) algorithms, a critical technique for accurate cable assembly characterization.
Topics to be covered in this webinar:
- Why S parameter accuracy depends on de embedding
- Key de embedding methodologies and when to use them
- What IEEE 370 2xThru algorithm is an advanced approach
- Deep dive: 2xThru, 1xReflect Short, and 1xReflect Open algorithms
- Practical example: achieving superior impedance corrected results with a simple, repeatable workflow
Who should attend? Design engineers focused on testing and validating high speed and high frequency PCB interconnects.
What will attendees learn? Why IEEE 370-2020 2x-Thru algorithms are necessary and how to correctly apply them to real-world measurements.
Presented by: Giuseppe Leccia, Teledyne LeCroy Product Marketing Manager
Can't join us live? Register now and receive the recording later.