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Sixty Seven

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Embedded Computing System Diagram

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Fundamentals of Characterizing High-speed
Serial Data Interconnects Webinar Q&A


During this webinar, several questions were asked. Here is a transcript of the questions and answers.
Click here to view the webinar.


Q:  When would one use differential vs common mode impedance? Why do the curves using either impedances look so different?
A:  Differential impedance is the impedance a differential signal see (i.e 100 Ohm), while the common mode impedance is what a common signal sees (i.e 25 Ohm) - Differential signals and common signals have different propagation terms.


Q:  I will review it from the beginning, currently I’m using an automatic machine which uses an Sparq unit to test the whole links on a PCB in SE mode, we are having issues with links with a small length
A:  Thanks for sharing - It could be related to the SPARQ set-up (frequency resolution, i.e time aliasing and acquisition length, i.e. repetition rate) - Please refer to our support line


Q:  How does this behave in nets shorter than 2 inches?
A:  Set min number of points (frequency resolution) and 50ns acquisition length


Q:  Impedance check tool => do you know if this used to control products in mass production?
A:  Mass production requires very fast testing - TDR techniques are only used for premium or critical DUTs or to do QA assessment. We have good experience in the areas of manufacturing


Q:  This is great if my board has SMA connectors on it, but my boards do not. Now what do I do? do I need to build special test boards with the same interconnects as my real board except with SMA connector son it? Or can I use my actual boards somehow?
A:  TDR probes can be used to make TDR measurements on boards. We have a very good price/performance ratio with both differential and single-ended TDR probes see pages 7-8 of the T3SP15D datasheet

Q:  Regarding your initial question of noise, is there a scenario where a "noisy" signal could pass through an innerconnect and become "cleaner"?
A:  Many thanks Christopher for your feedback. Yes we can get the scenario you described but not using linear DUTs. The next question is why not with linear DUTs?


Q:  What is the shortest rise time of the TDR?
A:  The rise time for the T3SP15D (calibrated True Differential TDR) is 30 ps. typ using one step as the stimulus, while for the WavePulser 40iX (High Speed Interconnect Analyzer) it is 8.5 ps typ using one pulse as the stimulus.


Q:  What types of calibration / calibration kits are provided for the Wave Pulser?
A:  With the WavePulser 40iX BUNDLE configuration we provide the OSLT cal kit (DC to 40GHz, RPC 2.92mm) from Rosenberger - Please note that the WavePulser 40IX has a built-in automatic calibration, so the cal kit is only used in case of manual calibration or verification of system performance.


Q:  On slide 33 the return loss plot does not look correct. 0 dB return loss ast DC indicates a sever mismatch somewhere
A:  Many thanks Jim, good catch! Thank you. The slides were used just to highlight the concept, I will review the data.


Q:  With the calibration question, if you are not using calibration sequences, are you just measuring the cable s parameters and de-embedding on all ports?
A:  Correct Jim! WavePulser can make de-embedding of cables, adapters and fixtures using frequency domain method required S-parameters. Find more on this topic, see app note: De-embedding with the WavePulser 40iX


Q:  Do customers use T3SP to control quality of products produces in high quantities ? (as end of line test)?
A:  Yes this is the case.

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Thirty Three

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Sixty Seven

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